Innovative product and application information for the Semicon Seal
Designer
The
Parofluor ULTRA™ materials cover the majority of application
requirements within the semiconductor industry including high purity,
high temperatures up to 320°C (608°F), and broad chemical
compatibility. Parofluor ULTRA™ offers many advantages to
the semiconductor seal designer in the following areas:
- Improved
compression set
- Improved
compressive stress relaxation (retained resiliency)
- Improved
plasma and chemical resistance
- Low particle
generation
- Improved
thermal stability
- Low outgassing
- Low permeation
- Low weight
loss under high vacuum
All Parofluor
materials are manufactured exclusively within our ULTRA™ High Purity
manufacturing cell. Here, care is taken to manufacture the product
within our clean manufacturing systems. Parker Parofluor ULTRA™ materials
are available in the following forms:
 O-Ring
Seals- Sheets/Slabs
- Custom
Molded Shapes
- Press-in-Place
Seals
- Composite
Seals (rubber bonded to metal)
These products
are an ideal choice in applications such as door seals, chamber
lid seals, valve seals, flanges, mass flow controls, windows and
quartz tubes.
Parker
Compound |
Color |
Normal
Hardness
(Shore A) |
Temperature
Range |
Feature |
General
Appication |
| FF200-75
|
Black
|
75
|
-15
°C to 320 °C
5°F to 608°F |
High
temperature
low
compression set
chemical resistance |
Ion
Implant, Metal CVD, Sputtering (PVD), Diffusion Furnaces,
LPCVD, RTP, Wafer Etch,Cleaning, Rinsing, Stripping, UPDI
|
| FF350-75
|
White
|
75
|
-15
°C to 316 °C
5 ° F to 600 °F |
High
purity
High temperature |
Ion
Implant, Metal CVD, Sputtering (PVD), Diffusion Furnaces,
LPCVD,
RTP, APCVD, HDPCVD, PCVD,Ashing, Plasma Etch, Plasma
Strip |
| FF500-75
|
Black
|
75
|
-15
°C to 275 °C
5 °F to 5 25°F |
Chemical
resistance |
Ion
Implant, CVD, Sputtering (PVD), Diffusion Furnaces,LPCVD,
RTP,
Water Etch, Cleaning, Rinsing, Stripping, UPDI |
| FF700-60 |
Translucent
|
60
|
-15°C
to 260°C
5 ° F to 500 ° F |
ULTRA™
high purity |
Ion
Implant, CVD, Sputtering (PVD), Diffusion Furnaces, LPCVD,
RTP, Water Etch, Cleaning, Rinsing, Stripping, UPDI where
ULTRA™-high purity is required |
|
